KIOXIA advances development of UFS Ver. 3.1 embedded flash memory devices

KIOXIA Europe GmbH has launched Universal Flash Storage (UFS) Ver. 3.1[1] embedded flash memory devices utilizing the company’s innovative 4-bit per cell quad-level-cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, KIOXIA’s QLC technology enables the capability to achieve the highest densities available in a single package.

Wednesday, 19th January 2022 Posted 3 years ago in by Phil Alsop

KIOXIA’s UFS proof of concept (PoC) device is a 512 gigabyte prototype that utilizes the company’s 1 terabit (128 gigabyte) BiCS FLASH 3D flash memory with QLC technology. The PoC device is designed to meet the increasing performance and density requirements of mobile applications driven by higher resolution images, 5G networks, 4K plus video and the like.

“KIOXIA has been an inventor and leading supplier of UFS memory since 2013. Since that time, we focus on expanding our already broad lineup with new UFS Memory products for applications that demand superior interface performance,” noted Axel Stoermann, Vice President Memory Marketing & Engineering, KIOXIA Europe GmbH. “With QLC UFS we can offer another solution which will meet the increasing requirements for Flash memory devices,” he continues.