MSP Channel Insights

IBM announces $3 billion research initiative to tackle chip challenges

Posted 11 years ago in by Phil Alsop

Scientists and engineers to push limits of silicon technology to 7 nanometers and below and create post-silicon future.

Posted 11 years ago in by Phil Alsop

Dell has announced key corporate responsibility achievements with the release of its Fiscal Year 2014 (FY14) Corporate Responsibility Report. The report provides the first progress update on the goals outlined last fall in the company’s 2020 Legacy of Good plan, a strategic roadmap for bringing sustainability and business objectives together, creating social and environmental benefits while enabling better customer outcomes.

Posted 11 years ago in by Phil Alsop

Intelligent, route-optimised IP transit creates high-performance e-commerce experience for British fashion house to engage its fans worldwide.

Posted 11 years ago in by Phil Alsop

Multilayer SDN controller and applications based on Ciena’s OPn network architecture enable software-defined, carrier-grade WANs.

Posted 11 years ago in by Phil Alsop

New EMC product releases help organizations “Redefine Possible” – reducing the cost of running application workloads while accelerating innovation through new application workloads.

Posted 11 years ago in by Phil Alsop

New consortium will seek to define connectivity requirements to ensure the interoperability of billions of devices projected to come online by 20201 – from PCs, smartphones and tablets to home and industrial appliances and new wearable form factors.

Networks + Telecoms

IBM announces $3 billion research initiative to tackle chip challenges

Dell reduces ‘energy intensity’ of product portfolio

Paul Smith teams with Internap

Ciena unveils Agility software portfolio

Accelerating the journey to the Hybrid Cloud

Industry leaders to establish Open Interconnect Consortium

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