Asetek receives first order of RackCDU Liquid Cooling System

Asetek has announced the first order for its RackCDU™ data center liquid cooling solution placed by one of its Original Equipment Manufacturing (OEM) partners for an undisclosed end customer. The milestone marks the first instance where an end user has purchased a liquid cooled High Performance Computing (HPC) cluster through one of Asetek’s OEMs. A total of 5 RackCDUs with cooling loops for a total of 280 compute nodes will be purchased for use in the HPC cluster.

  • Thursday, 19th September 2013 Posted 11 years ago in by Phil Alsop

This is the first purchase order of RackCDUs for actual installation; although Asetek has sold and delivered several RackCDUs for testing to customers over the past year. The liquid cooling loops will cool and remove all heat from the processors, co-processors, and memory. The loops will ensure the cluster maintains maximum energy efficiency and performance while keeping the operating costs at a minimum.

“It is rewarding for our investors, employees and customers to see our business model validated in this way,” said André Sloth Eriksen, Founder and CEO of Asetek. “This pivotal step shows that our data center solutions address the pain points of today’s data center operators in a practical and cost effective way.”

Data centers around the globe are being mandated to simultaneously increase energy efficiency, consolidate operations and reduce costs. Each year, data centers consume approximately 30bn watts of electricity, or one percent of global consumption, for cooling alone. Asetek has leveraged its expertise as the world leading provider of efficient liquid cooling systems to create solutions for data centers that address these mandates by providing energy savings, cost savings, density increases, and noise reduction.

RackCDU is Asetek’s innovative hot water, direct-to-chip, data center liquid cooling technology which removes up to 80% of the heat from servers with an all liquid path and rejects it into ambient outdoor air without chilling. This enables cooling cost reductions in excess of 50%, density increases of 2.5x, and recovery of all the server energy removed by RackCDU for reuse in facility heating and cooling.