ZutaCore has closed its Series C funding round, raising $100 million. Investors in the round include Mitsubishi Electric, Carrier Ventures, and Samsung Electronics through its corporate venture capital arm, Samsung Ventures. The funding is intended to support the company’s international expansion in response to increased demand for AI and high-performance computing (HPC) infrastructure.
The capital will be used to support development and deployment of ZutaCore’s direct-to-chip, two-phase, waterless cooling platform. The system is designed to handle AI and HPC processors with power levels exceeding 4,000 watts, enabling higher compute density and sustained performance in applicable environments.
The company reports more than 75 installations across the Americas, Europe, and Asia, with deployments in production environments. It also works with industry partners on thermal management systems intended to reduce constraints related to chip cooling and integration with existing data centre infrastructure.
To support expansion, the company has added several senior appointments: Yaniv Reinhold (CFO, with over 25 years of experience in finance and high-growth technology companies), Sarah Warshavsky Oberman (focused on workforce development and organisational transformation), Yoni Nir (engineering leadership in complex systems), and Sharon Shafran (experience in scaling global operations).
In response to increased demand for AI workloads and higher data center power densities, the company has established an End-of-Row emulation platform in Israel. This setup is used to simulate operating conditions without using live IT equipment, allowing performance validation at multi-megawatt scale.
One of the company’s product implementations includes the OmniTherm cold plate, which is used with NVIDIA RTX PRO 6000 Blackwell in a single-slot PCIe configuration for enterprise environments.
